Leadership Team

Helix's team combines Silicon Valley AI expertise with Taiwan's world-class HDI and semiconductor packaging capabilities to deliver advanced IC substrates, CoWoP/CoWoS packaging, and components for AI data centers and high-performance computing.

John-Paul Ho

CEO (U.S.)

Founder & Managing Partner, Crimson Capital (U.S.–Asia VC/PE; offices in Silicon Valley, Tokyo, Taipei, Shanghai, Singapore).
McKinsey Award for cross-border manufacturing; named a ‘Leading Investor in Asia’ by Time.
Built/invested in component makers serving Apple, Dell, Cisco, Sony, Samsung, Toshiba, Tesla, Medtronic, Agilent, ABB, GE; founded Omni (ASEAN electronics manufacturer; customers HP, Dell) and Ascent (software-driven, asset-light ASEAN supply chain/logistics; customers HP, Dell).
First Boston: Head of M&A Asia (ex-Japan); advised ASE (Nvidia AI GPU supplier) and Samsung; Toshiba Malaysia build-operate-transfer model. Goldman Sachs M&A (NY).
Government advisor to Taiwan and Singapore on upgrading to tech-intensive economies.
Research focus: robotics and human motion, globally competitive manufacturing, AI/medical applications, Lean/Six Sigma, Japanese quality.
Education: Harvard A.B. Engineering/Applied Math (decision & control), summa cum laude; Harvard MBA (Dean’s Doctoral selection); Harvard Medical School studies.

Dr. David Wang

Chairman (U.S.)

  • Applied Materials EVP: grew international sales from $1B to $10B in seven years; led industry-dominant semiconductor equipment roadmap.
  • Smithsonian added his Precision 5000 plasma etch system to its permanent collection alongside Apollo 11 and Shuttle Discovery.
  • Bell Labs: 100 semiconductor manufacturing patents generating $1B in licensing revenue.
  • Ph.D. Materials Science, UC Berkeley.

Dr. Jiang Yi

Chief Technology Officer (CTO)

  • Former TSMC Co-COO and Senior VP of R&D. Built R&D organization from 148 to 5,500. Developed and oversaw volume of production for CoWoS. Key manufacturing technology responsible for modern AI compute.
  • Board of Directors of Foxconn.
  • TSMC technology liaison to ASML.
  • Intel Technological Advisory Board.
  • Ph.D. Stanford, IEEE Fellow.

Kevin Kan

Senior Executive Vice President

  • Former Foxconn SVP, C-suite executive, and board director.
  • Built Apple/mobile division from 0 to $12B revenue and ~120k employees; scaled to $30B with headcount held roughly flat via factory automation.
  • Ran manufacturing across 10 countries; built Foxconn’s first autonomous ‘dark’ factory.
  • B.S. Mechanical Engineering (Taiwan educated).

Dr. Sam Liang

Senior Vice President (U.S./Taiwan)

  • Foxconn Senior Director: built operations and proprietary factory automation across China, Europe, and Latin America; won $500M Nokia business.
  • Wistron C-suite leader: built U.S. manufacturing operations.
  • Blackstone portfolio GM: launched Mexico manufacturing operations.
  • Led operations across the U.S., Europe, China, ASEAN, and South Asia; managed 10 factories and 20,000 employees.
  • Ph.D. Materials Science (U.S. educated); holder of four manufacturing process patents.

Dr. Richard Pon

Advisor

  • W-Con Electrical: high-speed interconnects for Nvidia AI data servers.
  • SpeedTech CTO: co-developed Tesla power connector, SpaceX communication connector, Intel data server high-speed connector; Intel & AMD CPU/GPU connectors.
  • Won Apple, Cisco switching, and Samsung programs at prior connector roles.
  • FCI International Connector Work Group representative alongside Intel, Molex, Tyco, TI, Elpida, Infineon, IBM, and HP.
  • Ph.D. Applied Mechanics (U.S.); roughly 30 connector patents.

Michael Serhan

Senior Vice President of Sales and Marketing

  • Veteran durable medical equipment (DME) executive; transformative leader who scaled Drive DeVilbiss Healthcare to $1B+ revenue and drove global market expansion.
  • Spearheaded innovation with 4,000+ SKUs and 22 patents, including industry-leading beds, wheelchairs, respiratory products, and rollators.
  • Set up dozens of factories across Asia and pioneered market entries across the U.S., North America, Europe, Central/South America, the Middle East, and Asia.
  • Undergraduate degree from the University of Colorado; completed executive education at the Duke Fuqua School of Business.

Helix's Advisory Board

Strategic advisors with deep expertise in technology, finance, and semiconductors.

Drew Peck

Senior Technology Advisor

  • MIT Lincoln Laboratory: Quantum Electronics Group.
  • Managing Director of DLJ's semiconductor equity research team. Selected multiple times for Institutional Investor All-America Research Team, including #1 ranking.
  • Partner at Crimson Capital. Led semiconductor investment group. Board member of numerous public and private deep tech companies.
  • Brandeis University, B.A. in Physics. MIT, M.S. degree in Management and Electrical Engineering.

Jacob Goldfield

Senior Advisor, Founding Investor in Helix

  • Former Senior Partner and Management Committee member of Goldman Sachs, Risk and Arbitrage Proprietary Trading.
  • Former Chief Investment Officer of Soros Management (Quantum Fund).
  • Former Harvard Management Corporation Board of Directors.
  • Managing Director, JG Fund Family Office. Early Investor in Ramp, Cognition, Long Lake Management Holdings.
  • Trustee, Cold Springs Harbor. Harvard College, B.A. in Physics.

Jesse Chen

Advisor (U.S.)

  • Dell Head of Asia Supply Chain: $30B annual spend; $5.5B Asia P&L cash flow; managed ~100 suppliers and 20 Dell factories worldwide.
  • DJO Global (Blackstone portfolio) SVP: oversaw $500M annual medical device spend.
  • Jabil Circuit Managing Director: built Asian manufacturing operations.
  • B.S. Computer Science (U.S. educated).